SRN-200
Evaporation system for thin film deposition , Lift-off process or metal electrode deposition for HBLED

A evaporator uses an electric resistance heater or high energy electron beam to melt the material and raise its vapor pressure to a useful range.
This is done in a high vacuum, both to allow the substrate without reacting with or scattering against other gas phase atoms in the chamber, and reduce the incorporation of impurities of from the residual gas in the vacuum chamber.
SORONA evaporation system is capable of fabrication multi-layer or co-evaporation. Also, arc suppression e-beam evaporator can be operated at the pressure of 5 mTorr and up.

Feature
Can be used with multiple sources
Precision control of film thickness
Excellent uniformity
Precise single rotating dome design (Standard)
Instant interchangeability of substrate size in dome type
Planetary design with very large batch sizes of equal to 216 x 2” wafers for HBLED(Option)
Very simple and easy loading of 2” wafers to planetary using fixture cover of one piece
Install of chamber shield without screws
Easy maintenance and exchange of all chamber shields for extended `Uptime’
Double shield with substrate and source
Smooth, Vibration-free rotation
Specialized fixture available(Lift-off fixture: standard)
Clip holder for irregular shaped substrate
Very smooth door’s locking of chamber
Uniform heating with halogen lamp heater located in wafer back-side
Co-evaporation or unlimited multiple-layer deposition with fully automation software

Process specification

Thickness Uniformity @ 3000Å Al, Ti Film(5mm exclusion)
- Within W, W to W, B to B : <± 5% at 8” wafer
Film Rs Uniformity @ 3000Å Al, Ti Film
- Within W, W to W, B to B : <± 5% at 8” wafer
Film Deposition Rate
- Al : > 300Å/min
- Ti : > 300Å/min
Heat uniformity on wafer surface : <± 5% @ 200'C